02249 晶合集成
NEXCHIP
NEXCHIP
| Register Close | 2026/07/07 IPO Closing in 7 Days |
| Listing Date | 2026/07/10 |
|
|
|
|
|
|
|
|
|
|
IPO Detail
COMPANY PROFILE
Nexchip Semiconductor Corporation is a leading pure-play foundry specializing in 12-inch wafer manufacturing, operating at a critical juncture of the global semiconductor value chain. Its foundry services cover technology nodes ranging from 150nm to 40nm, with the 28nm Logic IC platform successfully developed.
--
According to the report, from 2020 to 2025, the Group achieved the fastest growth in production capacity and revenue among the global top ten wafer foundries; in 2025, it ranked as the ninth largest wafer foundry worldwide and the third largest in Chinese Mainland by revenue.
--
The Group’s technology platform portfolio offers fabrication services primarily including DDIC, CIS and PMIC, with Logic IC and MCU scaling rapidly. The Group primarily provided wafer foundry services for IC design companies, including fabless, fablite and IDM companies. It serves a diversified customer base comprising leading IC design companies, including fabless, fablite and IDM companies, across end markets including consumer electronics, automotive electronics, smart home, industrial control, AI, the IoT and memory.
--
The Group operate a large-scale, integrated production base specializing in 12-inch wafer fabrication located in Hefei, Anhui Province. Its production with an average monthly production volume of 139.0 thousand pieces of 12-inch wafers in 2025.
BASIC INFORMATION
| Market | Hong Kong (Main Board) |
| Business Nature | Semiconductors |
| Major Business Area | China |
| Board Lot | 100 |
GLOBAL OFFERING
| No. of Offer Shares | 216.17M H shares |
| No. of International Offer Shares | 194.55M H shares |
| No. of HK Offer Shares | 21.62M H shares |
| Offer Price | $30.00 - $32.30 |
| Stock Code | 2249 |
| Sponsor(s) | China International Capital Corporation Hong Kong Securities Limited |
| Underwriter(s) | China International Capital Corporation Hong Kong Securities Limited, CLSA Limited, Huatai Financial Holdings (Hong Kong) Limited, BOCI Asia Limited, ICBC International Securities Limited, CMB International Capital Limited, Futu Securities International (Hong Kong) Limited |
TIME TABLE
| Application Period | Jun 30 (Tue) - noon, Jul 07 (Tue) |
| Price Determination Date | Jul 08 (Wed) |
| Result Announcement Date | On or before Jul 09 (Thu) |
| Result Announcement Date | On or before Jul 09 (Thu) |
| Result Announcement Date | On or before Jul 10 (Fri) |
| Dealings in Shares commence on | Jul 10, 2026. (Fri) |
Reallocation of Shares Offered
Sales Statistics (HKD)
| Offer Price | $30.00 - $32.30 |
| Capitalization | 124.61B - 125.11B |
| NAV / share ($) | $13.84 - $14.07 (Unaudited pro forma adj NAV / share) |
Use Of Proceeds
| Assuming the offer price being at HKD 31.15, the net proceeds raised would be HKD 6.54B, of which |
| 53.6% : R&D and optimization of next-generation 22nm technology platform to strengthen technological competitiveness |
| 23.1% : Used for intelligent R&D and production initiatives based on AI technology, establish an integrated intelligent system platform |
| 13.3% : Establishment of an R&D and sales center in Hong Kong |
| 10% : Ｗorking capital |
Related Document
| Prospectus |  Chinese Version | English Version |
| Remark： | The above information is referenced from the prospectus. |
| All data is calculated from the non- exercise rights(if applicable). |
Name︰
--
--
--
Subscription --
Result Announcement --
Listing --Offer Price︰--
| Currency | : |
| Listing Price | : |
| Board Lot | : |
| Admission Fee* |
: |
| Subscribing Lot | : |
| Subscribing Fee | : |
| Subscribing Amount | : |
*Admission fees include brokerage of 1%, SFC transaction levy of 0.0027%, Stock Exchange trading fee of 0.005% and FRC transaction levy of 0.00015% (i.e. 1.0077% in total).